Samsung Electronics has announced that it has started mass production of the industry’s first high-density ePoP memory for flagship smartphones.
Samsung’s ePoP (embedded package on package) memory is a single memory package that consists of a 3GB LPDDR3 DRAM, 32GB eMMC (embedded multi-media card), and a controller.
Before ePoP, conventional PoP packages consist of the mobile processor and DRAM, with the eMMC located in a separate package which takes up space. By utilizing the ePoP’s “one-package” design, smartphone manufacturers can now save some space and use it for other key components like a bigger battery.
The ePoP memory has a maximum measurement of 225 square millimeters (15x15mm) and meets the semiconductor package height ceiling of 1.4 millimeters (mm).
“By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features,” Jeeho Baek, Senior Vice President of Memory Marketing at Samsung Electronics.
source: Samsung Tomorrow
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